| Compatibility | Various Electronic Devices |
|---|---|
| Pressure Drop | Low |
| Heat Dissipation Method | Conduction |
| Material | Aluminum |
| Size | Customizable |
| Heat Dissipation | Efficient |
|---|---|
| Corrosion Resistance | Excellent |
| Weight | Customized |
| Compatibility | Versatile |
| Shape | Rectangular |
| Application | Electronic Devices |
|---|---|
| Surface Treatment | Powder Coating |
| Compatibility | Versatile |
| Precision | High |
| Shape | Rectangular |
| Thermal Conductivity | High |
|---|---|
| Customization | Available |
| Corrosion Resistance | Strong |
| Color | Silver |
| Shape | Customized |
| Durability | High |
|---|---|
| Application | Electronic Devices |
| Use | Aluminum Heatsink |
| Finishing | CNC Machining |
| Precision | High |
| Surface Treatment | Powder Coating |
|---|---|
| Compatibility | Versatile |
| Shape | Rectangular |
| Production Process | Die Casting |
| Weight | Customized |
| Lead Time | 3-4 Weeks |
|---|---|
| Raw Material | Pure Copper |
| Fin Density | Customized |
| Base Thickness | Customized |
| Thermal Conductivity | High |
| Durability | High |
|---|---|
| Weight | Lightweight |
| Material | Aluminium |
| Application | Electronic Equipment |
| Heat Conductivity | High |
